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| SIPMOS(R) Small-Signal Transistor BSP 149 q q q q q q q VDS 200 V ID 0.48 A RDS(on) 3.5 N channel Depletion mode High dynamic resistance Available grouped in VGS(th) Type Ordering Code Tape and Reel Information Pin Configuration Marking Package 1 G 2 D 3 S 4 D BSP 149 SOT-223 BSP 149 Q67000-S071 E6327: 1000 pcs/reel Maximum Ratings Parameter Drain-source voltage Drain-gate voltage, RGS = 20 k Gate-source voltage Gate-source peak voltage, aperiodic Continuous drain current, TA = 28 C Pulsed drain current, Max. power dissipation, Symbol Values 200 200 14 20 0.48 1.44 1.8 - 55 ... + 150 70 10 E 55/150/56 Unit V VDS VDGR VGS Vgs ID ID puls Ptot Tj, Tstg RthJA RthJS - - A W C K/W - TA = 25 C TA = 25 C Operating and storage temperature range Thermal resistance 1) chip-ambient chip-soldering point DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 1) Transistor on epoxy pcb 40 mm x 40 mm x 1.5 mm with 6 cm2 copper area for drain connection. Semiconductor Group 1 09.96 BSP 149 Electrical Characteristics at Tj = 25 C, unless otherwise specified. Parameter Symbol min. Static Characteristics Drain-source breakdown voltage VGS = - 3 V, ID = 0.25 mA Gate threshold voltage VDS = 3 V, ID = 1 mA Drain-source cutoff current VDS = 200 V, VGS = - 3 V Tj = 25 C Tj = 125 C Gate-source leakage current VGS = 20 V, VDS = 0 Drain-source on-resistance VGS = 0 V, ID = 0.03 A Dynamic Characteristics Forward transconductance VDS 2 x ID x RDS(on)max, ID = 0.48 A Input capacitance VGS = 0, VDS = 25 V, f = 1 MHz Output capacitance VGS = 0, VDS = 25 V, f = 1 MHz Reverse transfer capacitance VGS = 0, VDS = 25 V, f = 1 MHz Turn-on time ton, (ton = td(on) + tr) VDD = 30 V, VGS = - 2 ... + 5 V, RGS = 50 , ID = 0.29 A Turn-off time toff, (toff = td(off) + tf) VDD = 30 V, VGS = - 2 ... + 5 V, RGS = 50 , ID = 0.29 A Values typ. max. Unit V(BR)DSS 200 - - 1.2 - - 0.7 V VGS(th) IDSS - 1.8 A - - - - 10 2.5 0.2 200 nA - 100 - 3.5 IGSS RDS(on) gfs 0.4 0.75 500 40 12 7 20 60 50 - S pF - 670 60 20 10 30 80 65 ns Ciss Coss - Crss - td(on) tr td(off) tf - - - - Semiconductor Group 2 BSP 149 Electrical Characteristics (cont'd) at Tj = 25 C, unless otherwise specified. Parameter Reverse Diode Continuous reverse drain current TA = 25 C Pulsed reverse drain current TA = 25 C Diode forward on-voltage IF = 0.96 A, VGS = 0 Symbol min. Values typ. max. A - - - 0.9 Unit V V V V V V V V 0.48 1.44 V - Symbol Limit Values min. Range of VGS(th) Threshold voltage selected in groups P R S T U V W 1): Unit IS ISM - VSD 1.2 VGS(th) Grouping Test Condition - max. 0.15 - 0.80 - 0.93 - 1.06 - 1.19 - 1.32 - 1.45 - 1.58 VGS(th) VGS(th) - - 0.95 - 1.08 - 1.21 - 1.34 - 1.47 - 1.60 - 1.73 VD1 = 0.2 V; VD2 = 3 V; ID = 1 mA 1) A specific group cannot be ordered separately. Each reel only contains transistors from one group. Package Outline SOT-223 Dimensions in mm Semiconductor Group 3 BSP 149 Characteristics at Tj = 25 C, unless otherwise specified. Total power dissipation Ptot = f (TA) Safe operating area ID = f (VDS) parameter: D = 0.01, TC = 25 C Typ. output characteristics ID = f (VDS) parameter: tp = 80 s Typ. drain-source on-resistance RDS(on) = f (ID) parameter: VGS Semiconductor Group 4 BSP 149 Typ. transfer characteristics ID = f (VGS) parameter: tp = 80 s, VDS 2 x ID x RDS(on)max. Typ. forward transconductance gfs = f (ID) parameter: VDS 2 x ID x RDS(on)max., tp = 80 s Drain-source on-resistance RDS(on) = f (Tj) parameter: ID = 0.03 A, VGS = 0 V, (spread) Typ. capacitances C = f (VDS) parameter: VGS = 0, f = 1 MHz Semiconductor Group 5 BSP 149 Gate threshold voltage VGS(th) = f (Tj) parameter: VDS = 3 V, ID = 1 mA, (spread) Forward characteristics of reverse diode IF = f (VSD) parameter: tp = 80 s, Tj, (spread) Drain current ID = f (TA) parameter: VGS 3 V Safe operating area ID = f (VDS) parameter: D = 0, TC = 25 C Semiconductor Group 6 BSP 149 Drain-source breakdown voltage V(BR) DSS = b x V(BR)DSS (25 C) Semiconductor Group 7 |
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